Lead Free Solder SWF-08 ENGINEER

Peel strength is equivalent to that of conventional eutectic solders.Resin does not contain chlorinated or brominated surfactant. Washing is not required after soldering.For soldering works in lead-free environment.Wire Diameter x L (mm x m):0.8 x 4.4Melting point: 217CFlux: JIS-AA classAlloy composition(tin: 96.5%, silver: 3%, copper: 0.5%)